• Oxygen free solid copper cores
• Triple layer ultra low signal absorbing dielectric
• First dielectric layer creates a separate twisted signal pair
• Oxygen free 1/2” thick braided copper shielding
• Gold plated interconnects

The Signature Series difference:

• Multi gauge oxygen free solid copper cores to reduce internal inductance
• Quadruple layer ultra low signal absorbing dielectric - inert to microphonic pickup
• Oxygen free 3/4" thick braided copper shielding